Термопаста HTK-002-U1-GP COOLER MASTER

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

• Suitable for CPU, chipsets on Mainboard, VGA card, etc.
• Easy to use
• Zif Socket Templates ensure correct applying area with various CPU socket types.
• Produces an even layer when using applicator.
• Dielectric.
• Wide range of application temperature